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in postSHORT
“SPHBM4 skips that interposer and seats memory directly on the lower organic substrate”
@damnang2
SPHBM4 bypasses TSMC's silicon interposer (CoWoS), threatening its most defensible AI packaging moat.
TSMSHORT@ $463.40
$396.21+14.50%
since call Jun 22
peak +19.9%
in postLONG
“reusing DRAM it already makes and just swapping the bottom chip, so as new standards go, the barrier to entry is low”
@damnang2
SPHBM4 reuses HBM4 DRAM unchanged, lowering adoption barriers and expanding HBM demand for all memory makers including Micron.
MULONG@ $1,191.07
$814.11-31.65%
since call Jun 22
TIMESTAMPS
in post
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