TSMC is the irreplaceable chokepoint in AI chips; hyperscalers going direct to TSM bypasses co-designers and concentrates more pricing power and revenue at the foundry.
Optical interconnects will grow from near-zero to 30% of the AI data center interconnect mix in 2-3 years as rack-to-rack distances scale beyond copper's reach.
AVGO's AI co-design premium is peaking as hyperscalers move in-house; TSM allocation, not design expertise, was the real moat all along.