Intel Foundry's advanced packaging prowess (EMIB, Foveros 3D, 18A) makes it a credible second source to TSMC
Vertiv benefits as prefab modular AI infrastructure blocks halve data center deployment time
Marvell is repositioning as the dominant optical interconnect company as the copper wall hits the rack
CPO yield stalls push AI optics toward near-package and pluggable transceivers, lifting EML-laser leader Lumentum.
Silicon, not GaN, does the sub-800V conversion work, deflating the WBG-displacement story NVTS is priced on.