“Memory runs through Micron, compute through Nvidia, custom silicon through Broadcom, networking through Arista, connectivity through Credo and Astera, and the power-and-thermal layer through Vertiv, P”
Arista dominates the networking layer of AI data centers and recently raised its 2026 AI revenue target to $3.5 billion as physical infrastructure scales.
“Memory runs through Micron, compute through Nvidia, custom silicon through Broadcom, networking through Arista, connectivity through Credo and Astera, and the power-and-thermal layer through Vertiv, P”
Broadcom owns the custom silicon layer of the AI buildout, securing $10.8 billion in quarterly revenue as tech giants race to build physical data centers.
“Memory runs through Micron, compute through Nvidia, custom silicon through Broadcom, networking through Arista, connectivity through Credo and Astera, and the power-and-thermal layer through Vertiv, P”
Astera Labs builds the physical connectivity layer that wires together AI data centers, a mandatory constraint driving their 93% revenue jump.
“Vertiv is not only selling into more megawatts, it is capturing more dollars inside each one as the racks densify and the system gets harder to assemble by hand.”
Hotter AI chips force data centers to buy complex cooling systems, letting Vertiv extract $3.25 to $3.75 million per megawatt built.
“Memory runs through Micron, compute through Nvidia, custom silicon through Broadcom, networking through Arista, connectivity through Credo and Astera, and the power-and-thermal layer through Vertiv, P”
Nvidia commands 85% of the global AI chip market and acts as the foundational compute engine driving the massive data center expansion.
“Memory runs through Micron, compute through Nvidia, custom silicon through Broadcom, networking through Arista, connectivity through Credo and Astera, and the power-and-thermal layer through Vertiv, P”
AI data centers are hitting a physical wall with power and cooling, so buy Powell as its record $1.8 billion backlog proves it is solving the bottleneck.
“Memory runs through Micron, compute through Nvidia, custom silicon through Broadcom, networking through Arista, connectivity through Credo and Astera, and the power-and-thermal layer through Vertiv, P”
Credo builds the essential wiring that connects massive data centers, capturing the physical AI buildout as revenue surges 206 percent to $1.34 billion.
“Data center orders in its Electrical Americas segment ran up roughly 240 percent year over year last quarter... The Boyd Thermal deal hands it a real position in liquid cooling and the white space.”
Eaton is capturing the AI power constraint with data center orders up 240% and a new liquid cooling position via the Boyd Thermal deal.
“Memory runs through Micron, compute through Nvidia, custom silicon through Broadcom, networking through Arista, connectivity through Credo and Astera, and the power-and-thermal layer through Vertiv, P”
Micron captures the memory layer of the AI buildout, which must be physically deployed regardless of which software models win.