Every named company adopting 3D stacking must go through TSMC's SoIC packaging, making it the unavoidable toll booth of the memory-on-logic wave.
Qualcomm's HBC 3D stacking architecture opens a $15B data center revenue stream by 2029, re-rating it far beyond a mobile-chip company.
Broadcom's 3D stacking adoption for AI XPUs by 2028-29 accelerates its custom silicon franchise with Google, OpenAI, Meta, and ByteDance as anchor customers.
Nvidia's confirmed 3D logic stacking in its 2028 Feynman GPU generation adds another step-change in AI compute performance, sustaining its hardware lead.