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“physical shortages across HBM (High-Bandwidth Memory) and advanced packaging (like TSMC's CoWoS-L) will remain the core constraint for the industry for the next”
@RJCcapital
TSMC's CoWoS-L packaging is a named 18-month bottleneck for AI chips, locking in premium pricing and revenue visibility on its highest-margin service
TSMLONG@ $441.98
$396.57-10.28%
since call Jun 24
in postLONG
“NVIDIA Management (including CFO Colette Kress) confirmed that physical shortages across HBM (High-Bandwidth Memory) and advanced packaging (like TSMC's CoWoS-L”
@RJCcapital
NVIDIA GPU scarcity persists 18 months as HBM and CoWoS-L bottlenecks keep supply below demand, sustaining elevated pricing and backlog
NVDALONG@ $201.44
$199.91-0.76%
since call Jun 24
peak +8.2%
in postLONG
“physical shortages across HBM (High-Bandwidth Memory) and advanced packaging (like TSMC's CoWoS-L) will remain the core constraint for the industry for the next”
@RJCcapital
HBM shortage locked in for 18 months by NVIDIA management; SK Hynix as dominant HBM supplier holds sustained pricing power
SKHXLONGIDEA · NOT YET PRICED
TIMESTAMPS
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