“TSMC plans to invest tens of billions of Taiwan dollars in a new advanced chip packaging plant in the Central Taiwan Science Park near Erlin Township”
@dnystedt
TSMC builds a massive new CoWoS-L packaging plant, expanding its AI chip packaging moat and signaling surging demand
“TSMC plans to invest tens of billions of Taiwan dollars in a new advanced chip packaging plant in the Central Taiwan Science Park near Erlin Township”
@dnystedt
TSMC CoWoS-L capacity expansion directly relieves the packaging bottleneck on NVIDIA's AI GPU supply, bullish NVDA