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in postLONG
“From 2022 to 2026 demand for AI accelerator wafers grew 11x, while large-die wafer demand grew 6x”
@dnystedt
AI accelerator wafer demand grew 11x in four years and CoWoS packaging hit 98% yield — NVDA, as the dominant buyer of both, is the demand-side winner of the AI chip ramp.
NVDALONG@ $192.69
$199.52+3.54%
since call Jun 26
peak +11.1%
in postLONG
“Advanced packaging CoWoS and SoIC to expand 80% annually (CAGR) 2022-2027”
@dnystedt
TSMC's CoWoS and SoIC advanced packaging expanding 80% CAGR through 2027 drives massive capex for packaging equipment, with Applied Materials the largest equipment supplier directly tied to that buildout.
AMATLONG@ $627.63
$504.15-19.67%
since call Jun 26
in postLONG
“N2/A16 capacity expected to expand at 70% annually (CAGR) 2026-2028”
@dnystedt
TSMC's N2/CoWoS capacity ramp at 70-80% CAGR and 11x AI wafer demand growth make TSM the clearest compounder in the AI chip supercycle.
TSMLONG@ $437.79
$395.77-9.60%
since call Jun 26
TIMESTAMPS
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