← dnystedtTrade on Hyperliquid →Trade on Hyperliquid →Trade on Hyperliquid →
in postLONG
“TSMC is expected to manufacture Qualcomm's Dragonfly C100 data center CPUs and AI300 AI accelerator chips on 3nm/2nm and use CoWoS or SoIC advanced packaging, m”
@dnystedt
TSMC wins Qualcomm's entire Dragonfly CPU/AI chip build on 3nm/2nm plus CoWoS and SoIC advanced packaging, adding another hyperscale customer to its leading-edge node backlog.
TSMLONG@ $438.07
$396.90-9.40%
since call Jun 26
in postLONG
“TSMC is expected to manufacture Qualcomm's Dragonfly C100 data center CPUs and AI300 AI accelerator chips on 3nm/2nm and use CoWoS or SoIC advanced packaging, m”
@dnystedt
Qualcomm's Dragonfly data center platform targets $15B+ DC revenue by FY2029, opening a massive new market beyond mobile.
QCOMLONG@ $187.78
$149.69-20.28%
since call Jun 26
in postLONG
“TSMC is expected to manufacture Qualcomm's Dragonfly C100 data center CPUs and AI300 AI accelerator chips on 3nm/2nm and use CoWoS or SoIC advanced packaging, m”
@dnystedt
Micron is named as a Qualcomm data center memory partner, adding a new demand source on top of already sold-out HBM supply and a blowout Q3 beat.
MULONG@ $1,139.26
$815.07-28.46%
since call Jun 26
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