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in postLONG
“Advanced packaging is a major priority. Intel is heavily promoting EMIB as a scalable and cost-effective alternative to CoWoS.”
@au_xbt · AU🧲
Intel's aggressive EMIB and advanced packaging scale-up directly expands the semiconductor equipment market, with AMAT as the largest public beneficiary
AMATLONG@ $628.04
$504.83-19.62%
since call Jun 22
“Intel is targeting a 10x shareholder return over the next 5-10 years. Tan is benchmarking against the 76-85x return delivered during his Cadence tenure.”
@au_xbt · AU🧲
Intel's 18A ramp, foundry buildout, and glass substrate commitment set up a multi-year rerating toward a 10x shareholder return
INTCLONG@ $139.39
$88.54-36.48%
since call Jun 22
in postLONG
“In my view, $GLW remains significantly undervalued. When will Corning finally catch up?”
@au_xbt · AU🧲
Corning hasn't caught up to Chinese glass/fiber peers that already surged 30%+ on Intel's glass substrate commitment, plus CPO optical tailwind gives it ~21% of switch BoM
GLWLONG@ $202.19
$139.62-30.94%
since call Jun 22
in postLONG
“The biggest AI bottlenecks are not models. They are power, helium supply, HBM, DRAM, and semiconductor manufacturing capacity.”
@au_xbt · AU🧲
HBM and DRAM are named AI industry bottlenecks by Intel's CEO, making Micron — the only US-listed HBM/DRAM pure-play — a structural beneficiary
MULONG@ $1,178.84
$815.25-30.84%
since call Jun 22
“The biggest AI bottlenecks are not models. They are power, helium supply, HBM, DRAM, and semiconductor manufacturing capacity.”
@au_xbt · AU🧲
Power and cooling are named AI infrastructure bottlenecks, making Vertiv the tightest-linked play as the leading AI data center thermal management company
VRTLONG@ $332.72
$236.26-28.99%
since call Jun 22
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